David Domina
3Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Dec 12, 2006 → Apr 29, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8034718B2 | Method to recover patterned semiconductor wafers for rework | Electricity | 0 | Active |
| US7666689B2 | Method to remove circuit patterns from a wafer | Performing Operations; Transporting | 0 | Active |
| US8210904B2 | Slurryless mechanical planarization for substrate reclamation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.