Method to recover patterned semiconductor wafers for rework
US8034718B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2008 |
| Grant date | Oct 11, 2011 |
| Priority date | — |
| Expiry date | Aug 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02032
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are embodiments of a method of removing patterned circuit structures from the surface of a semiconductor wafer. The method embodiments comprise blasting the surface of the semiconductor wafer with particles so as to remove substantially all of the patterned circuit structures. The blasting process is followed by one or more grinding, polishing and/or cleaning processes to remove any remaining circuit structures, to remove any lattice damage and/or to achieve a desired smoothness across the surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.