David Ludwig
12Patents
7h-index
19Co-inventors
63Inventor score
Filing activity: Oct 20, 1994 → Jan 9, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5581498A | Stack of IC chips in lieu of single IC chip | Electricity | 391 | Expired |
| US7436494B1 | Three-dimensional ladar module with alignment reference insert circuitry | Physics | 94 | Active |
| US8279420B2 | Phase sensing and scanning time of flight LADAR using atmospheric absorption bands | Physics | 90 | Active |
| US8125367B2 | AM chirp LADAR readout circuit and module | Electricity | 38 | Active |
| US8198576B2 | Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure | Electricity | 25 | Active |
| US7180579B1 | Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuits | Physics | 7 | Expired |
| US10078137B2 | LIDAR device and method for clear and degraded environmental viewing conditions | Physics | 7 | Active |
| USRE43722E1 | Three-dimensional ladar module with alignment reference insert circuitry | General | 6 | Active |
| US10078791B2 | Methods and devices for cognitive-based image data analytics in real time | Physics | 4 | Active |
| US9129780B2 | Stacked micro-channel plate assembly comprising a micro-lens | Electricity | 0 | Active |
| US9142380B2 | Sensor system comprising stacked micro-channel plate detector | Electricity | 0 | Active |
| USRE43877E1 | Method for precision integrated circuit die singulation using differential etch rates | General | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.