Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure

US8198576B2 · kind B2 · utility

Assignee

• Aprolase Development Co., LLC · US

Inventors

• John Vedamuthu Kennedy · Lower Hutt, NZ
• David Ludwig · Irvine, US
• Christian Krutzik · Brooks Road, US

Key dates

• Filing date: Oct 10, 2008
• Grant date: Jun 12, 2012
• Expiry date: Aug 7, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A 3-D LADAR imaging system incorporating stacked microelectronic layers is provided. A reference insert circuit inserts data into the FIFO registers at a preselected location to provide a reference point at which all FIFO shift register data may be aligned to accommodate for timing differences between layers and channels. The bin data representing the photon reflections from the various target surfaces are read out of the FIFO and processed using appropriate circuitry such as a field programmable gate array to create a synchronized 3-D point cloud for creating a 3-D target image.