David Zoba
5Patents
5h-index
6Co-inventors
45Inventor score
Filing activity: Jul 20, 2000 → Feb 2, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6737750B1 | Structures for improving heat dissipation in stacked semiconductor packages | Electricity | 147 | Expired |
| US6472758B1 | Semiconductor package including stacked semiconductor dies and bond wires | Emerging Cross-Sectional Technologies | 105 | Expired |
| US6603072B1 | Making leadframe semiconductor packages with stacked dies and interconnecting interposer | Electricity | 99 | Expired |
| US6919631B1 | Structures for improving heat dissipation in stacked semiconductor packages | Electricity | 78 | Expired |
| US6650019B2 | Method of making a semiconductor package including stacked semiconductor dies | Emerging Cross-Sectional Technologies | 71 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.