DeAnn Eileen Melcher
6Patents
3h-index
16Co-inventors
43Inventor score
Filing activity: Jun 19, 2008 → May 17, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7923349B2 | Wafer level surface passivation of stackable integrated circuit chips | Electricity | 31 | Active |
| US7863159B2 | Semiconductor die separation method | Electricity | 18 | Active |
| US8704379B2 | Semiconductor die mount by conformal die coating | Electricity | 12 | Active |
| US9153517B2 | Electrical connector between die pad and z-interconnect for stacked die assemblies | Electricity | 3 | Active |
| US8324081B2 | Wafer level surface passivation of stackable integrated circuit chips | Electricity | 1 | Active |
| US8884403B2 | Semiconductor die array structure | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.