Denis Amparo
10Patents
5h-index
13Co-inventors
59Inventor score
Filing activity: Jan 7, 2011 → Jul 24, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8437818B1 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Electricity | 62 | Active |
| US8301214B1 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Electricity | 49 | Active |
| US9130116B1 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Electricity | 17 | Active |
| US10222416B1 | System and method for array diagnostics in superconducting integrated circuit | Electricity | 8 | Active |
| US9741920B1 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Electricity | 7 | Active |
| US10833243B1 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Electricity | 3 | Active |
| US11711985B2 | System and method for superconducting multi-chip module | Electricity | 1 | Active |
| US11121302B2 | System and method for superconducting multi-chip module | Electricity | 1 | Active |
| US10505097B1 | System and method for array diagnostics in superconducting integrated circuit | Electricity | 0 | Active |
| US12317757B2 | System and method for superconducting multi-chip module | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.