Derek Wong
5Patents
4h-index
14Co-inventors
43Inventor score
Filing activity: Aug 20, 2014 → Jan 23, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9245739B2 | Low-K oxide deposition by hydrolysis and condensation | Electricity | 14 | Active |
| US10049921B2 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Electricity | 11 | Active |
| US9583386B2 | Interlevel conductor pre-fill utilizing selective barrier deposition | Electricity | 9 | Active |
| US10262943B2 | Interlevel conductor pre-fill utilizing selective barrier deposition | Electricity | 6 | Active |
| US9875968B2 | Interlevel conductor pre-fill utilizing selective barrier deposition | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.