Didem Ernur
4Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Jul 13, 2005 → Nov 23, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8080505B2 | Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals | Electricity | 7 | Active |
| US7589052B2 | Slurry composition and method for chemical mechanical polishing of copper integrated with tungsten based barrier metals | Electricity | 0 | Active |
| US8330238B2 | Microscopic structure packaging method and device with packaged microscopic structure | Performing Operations; Transporting | 0 | Active |
| US8722527B2 | Integrated circuit manufacturing method and integrated circuit | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.