Microscopic structure packaging method and device with packaged microscopic structure
US8330238B2 · kind B2 · utility
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2References
14Claims
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Assignee
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Key dates
| Filing date | Nov 23, 2010 |
| Grant date | Dec 11, 2012 |
| Priority date | — |
| Expiry date | Sep 8, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.