Diong Hing Ding
4Patents
3h-index
9Co-inventors
47Inventor score
Filing activity: Sep 18, 2000 → Mar 5, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6632690B2 | Method of fabricating reliable laminate flip-chip assembly | Electricity | 5 | Expired |
| US6409070B1 | Minimizing flux residue by controlling amount of moisture during reflow | Electricity | 5 | Expired |
| US7601612B1 | Method for forming solder joints for a flip chip assembly | Emerging Cross-Sectional Technologies | 3 | Active |
| US11450732B2 | Structure for capacitor protection, package structure, and method of forming package structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.