Method of fabricating reliable laminate flip-chip assembly
US6632690B2 · kind B2 · utility
5Cited by
4References
8Claims
0Family size
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Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Oct 14, 2003 |
| Priority date | — |
| Expiry date | Feb 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating laminate assemblies determines the ideal weight (W) of underfill to be dispensed, based on the size of the semiconductor die and the gap between the die and the laminate substrate. Underfill is dispensed in a single step in an amount between 1.1W and 1.3W to form fillets that cover at least 15% of the height of the semiconductor die on all four sides of the die. The amount of underfill ensures that the fillet coverage imbalance is 30% or less for each of the pairs of opposing sides of the die, thereby improving solder joint reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.