Duk-Ho Hong
5Patents
3h-index
14Co-inventors
43Inventor score
Filing activity: Sep 3, 2002 → Sep 28, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7166019B2 | Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6976902B2 | Chemical mechanical polishing apparatus | Performing Operations; Transporting | 5 | Expired |
| US6924234B2 | Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper | Electricity | 3 | Expired |
| US7435673B2 | Methods of forming integrated circuit devices having metal interconnect structures therein | Electricity | 2 | Active |
| US7282451B2 | Methods of forming integrated circuit devices having metal interconnect layers therein | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.