Flexible membrane for a polishing head and chemical mechanical polishing (CMP) apparatus having the same
US7166019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2005 |
| Grant date | Jan 23, 2007 |
| Priority date | — |
| Expiry date | May 21, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.