Inventor · Cupertino, CA, US

Ed C. Lee

15Patents
8h-index
19Co-inventors
69Inventor score

Filing activity: Apr 25, 1984 → Nov 8, 2006

Most-cited inventions

PatentTitleAreaCited byStatus
US6905547B1 Method and apparatus for flexible atomic layer deposition Chemistry; Metallurgy 46 Expired
US4566026A Integrated circuit bimetal layer Electricity 27 Expired
US6254936A Environment exchange control for material on a wafer surface Physics 22 Expired
US6977098B2 Method of uniformly coating a substrate Performing Operations; Transporting 15 Expired
US6468586B1 Environment exchange control for material on a wafer surface Physics 14 Expired
US6780461B2 Environment exchange control for material on a wafer surface Physics 13 Expired
US6248171A Yield and line width performance for liquid polymers and other materials Performing Operations; Transporting 12 Expired
US6669779B2 Yield and line width performance for liquid polymers and other materials Performing Operations; Transporting 8 Expired
US6242364A Plasma deposition of spin chucks to reduce contamination of silicon wafers Emerging Cross-Sectional Technologies 7 Expired
US6844027B1 Environment exchange control for material on a wafer surface Physics 7 Expired
US7208262B2 Yield and line width performance for liquid polymers and other materials Performing Operations; Transporting 3 Expired
US7255975B2 Yield and line width performance for liquid polymers and other materials Performing Operations; Transporting 1 Expired
US6911091B2 Environment exchange control for material on a wafer surface Physics 1 Expired
US6955720B2 Plasma deposition of spin chucks to reduce contamination of Silicon wafers Emerging Cross-Sectional Technologies 1 Expired
US7625692B2 Yield and line width performance for liquid polymers and other materials Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.