Plasma deposition of spin chucks to reduce contamination of Silicon wafers
US6955720B2 · kind B2 · utility
1Cited by
18References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2001 |
| Grant date | Oct 18, 2005 |
| Priority date | — |
| Expiry date | Jun 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for delivering a fluidic media to a wafer includes a housing defining a process chamber. A fluidic media delivery member is coupled to the process chamber. A rotatable chuck is positioned in the process chamber. The rotatable chuck has a wafer support surface coated with a coating material. A vacuum supply line is coupled to the rotatable chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.