Eric Bogatin
10Patents
7h-index
15Co-inventors
63Inventor score
Filing activity: Mar 15, 1985 → Aug 25, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5528083A | Thin film chip capacitor for electrical noise reduction in integrated circuits | Emerging Cross-Sectional Technologies | 85 | Expired |
| US5629240A | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Electricity | 60 | Expired |
| US6096576A | Method of producing an electrical interface to an integrated circuit device having high density I/O count | Electricity | 44 | Expired |
| US6452260B1 | Electrical interface to integrated circuit device having high density I/O count | Electricity | 43 | Expired |
| US4816811A | Compliant overlay for use as an optically-based touch-sensitive screen | Physics | 24 | Expired |
| US5780930A | Method for direct attachment of an on-chip bypass capacitor in an integrated circuit | Electricity | 24 | Expired |
| US5138149A | Apparatus and method for monitoring radiant energy signals with variable signal gain and resolution enhancement | Physics | 15 | Expired |
| US7498826B2 | Probe array wafer | Physics | 1 | Active |
| US7049670B2 | Electro ceramic components | Physics | 0 | Expired |
| US6764881B2 | Method for manufacturing electro ceramic components | Physics | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.