Patent · US Active

Probe array wafer

US7498826B2 · kind B2 · utility

1Cited by

15References

18Claims

0Family size

Assignee

Interconnect Devices, Inc. · US

Inventors

Eric Bogatin · Olathe, US
David Henry · Platte City, US
Donald A. Marx · Olathe, US

Key dates

Filing date	Aug 25, 2006
Grant date	Mar 3, 2009
Priority date	—
Expiry date	Nov 10, 2026

Classification

Technology area (CPC G)Physics
CPC primaryG01R1/07364
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A probe array wafer includes a substrate upon which a plurality of compliant probes are mounted. Pairs of axially aligned probes may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes may be electrically connected together to provide a ground connection from the test equipment to the device under test.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.