Eric Rouya
3Patents
0h-index
6Co-inventors
27Inventor score
Filing activity: Sep 15, 2015 → Apr 1, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11434578B2 | Cobalt filling of interconnects in microelectronics | Chemistry; Metallurgy | 0 | Active |
| US10995417B2 | Cobalt filling of interconnects in microelectronics | Chemistry; Metallurgy | 0 | Active |
| US10294574B2 | Levelers for copper deposition in microelectronics | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.