Levelers for copper deposition in microelectronics
US10294574B2 · kind B2 · utility
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3References
9Claims
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Key dates
| Filing date | Sep 15, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Feb 6, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.