Eui Rang LEE
2Patents
0h-index
6Co-inventors
21Inventor score
Filing activity: Jan 22, 2021 → Jul 19, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12139642B2 | CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same | Electricity | 0 | Active |
| US11560495B2 | CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.