Eul-bin Im
2Patents
2h-index
7Co-inventors
27Inventor score
Filing activity: Feb 22, 2001 → Feb 26, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6432750B1 | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof | Electricity | 77 | Expired |
| US6574107B2 | Stacked intelligent power module package | Electricity | 51 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.