Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
US6432750B1 · kind B1 · utility
77Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2001 |
| Grant date | Aug 13, 2002 |
| Priority date | — |
| Expiry date | Feb 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.