Stacked intelligent power module package
US6574107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Mar 31, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stacked intelligent power module package is provided. The intelligent power module package of the present invention includes a power unit including a heat sink and a control unit which is separately manufactured from the power unit and is subsequently stacked on the power unit. The power unit and the control unit of the intelligent power module package are stacked in two different ways including stacking two wire-bonded leadframes of the power unit and the control unit and stacking two separate semiconductor packages of the power unit and the control unit by using locking means formed in each of the semiconductor packages after a trimming/forming process and an electrical property test are finished.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.