Eun-Young Min
2Patents
2h-index
6Co-inventors
27Inventor score
Filing activity: Apr 5, 2001 → Oct 4, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6465895B1 | Bonding pad structures for semiconductor devices and fabrication methods thereof | Electricity | 19 | Expired |
| US6555450B2 | Contact forming method for semiconductor device | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.