Ewa Oldak
4Patents
4h-index
8Co-inventors
39Inventor score
Filing activity: Nov 16, 1999 → Jan 26, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6194366A | Post chemical-mechanical planarization (CMP) cleaning composition | Chemistry; Metallurgy | 56 | Expired |
| US6723691B2 | Post chemical-mechanical planarization (CMP) cleaning composition | Chemistry; Metallurgy | 39 | Expired |
| US7923423B2 | Compositions for processing of semiconductor substrates | Chemistry; Metallurgy | 19 | Expired |
| US7922823B2 | Compositions for processing of semiconductor substrates | Chemistry; Metallurgy | 11 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.