Method and device for polishing semiconductor wafers

US5980361A · kind A · utility

Assignee

• Wacker Siltronic Gesellschaft Fur Halbleitermaterialien AG · DE

Inventors

• Paul Muller · Heidelberg, DE
• Thomas Buschhardt · Burghausen, DE
• Heinrich Hennhofer · Tirschenreuth, DE
• Norbert Sickmann · Burghausen, DE
• Rainer Neumann · Krefeld, DE
• Franz Mangs · Tittmoning, DE
• Manfred Thurner · Ach, AT
• Klaus Rottger · Munich, DE

Key dates

• Filing date: Dec 9, 1997
• Grant date: Nov 9, 1999
• Expiry date: Dec 9, 2017

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/16
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.