Fuqiang Xiao
4Patents
2h-index
10Co-inventors
41Inventor score
Filing activity: May 18, 2011 → Oct 29, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9704797B2 | Waterfall wire bonding | Electricity | 8 | Active |
| US10177119B2 | Fan out semiconductor device including a plurality of semiconductor die | Electricity | 5 | Active |
| US12051660B2 | Wire bond pad design for compact stacked-die package | Electricity | 0 | Active |
| US11189582B2 | Wire bond pad design for compact stacked-die package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.