Waterfall wire bonding
US9704797B2 · kind B2 · utility
8Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 18, 2011 |
| Grant date | Jul 11, 2017 |
| Priority date | — |
| Expiry date | May 18, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.