Inventor · Woodstock, VT, US

Gary Horsman

5Patents
3h-index
7Co-inventors
42Inventor score

Filing activity: May 22, 2001 → Jul 10, 2007

Most-cited inventions

PatentTitleAreaCited byStatus
US6489660B1 Low-voltage punch-through bi-directional transient-voltage suppression devices Electricity 39 Expired
US6919625B2 Surface mount multichip devices Emerging Cross-Sectional Technologies 9 Expired
US7242078B2 Surface mount multichip devices Emerging Cross-Sectional Technologies 5 Expired
US7525183B2 Surface mount multichip devices Emerging Cross-Sectional Technologies 3 Active
US6602769B2 Low-voltage punch-through bi-directional transient-voltage suppression devices and methods of making the same Electricity 3 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.