Giovanni Capuz
2Patents
0h-index
5Co-inventors
24Inventor score
Filing activity: Oct 31, 2017 → Jun 19, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11362061B2 | Method for the electrical bonding of semiconductor components | Electricity | 0 | Active |
| US10797016B2 | Method for bonding semiconductor chips to a landing wafer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.