Method for bonding semiconductor chips to a landing wafer
US10797016B2 · kind B2 · utility
0Cited by
0References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Oct 6, 2020 |
| Priority date | — |
| Expiry date | Nov 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding chips to a landing wafer is disclosed. In one aspect, a volume of alignment liquid is dispensed on a wettable surface of the chip so as to become attached to the surface, after which the chip is moved towards the bonding site on the wafer, the bonding site equally being provided with a wettable surface. A liquid bridge is formed between the chip and the bonding site on the substrate wafer, enabling self-alignment of the chip. Dispensing alignment liquid on the chip and not the wafer is advantageous in terms of mitigating unwanted evaporation of the liquid prior to bonding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.