Gunther Kann
2Patents
1h-index
8Co-inventors
30Inventor score
Filing activity: Jun 18, 2002 → Jan 27, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6793837B2 | Process for material-removing machining of both sides of semiconductor wafers | Performing Operations; Transporting | 8 | Expired |
| US6997776B2 | Process for producing a semiconductor wafer | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.