Process for material-removing machining of both sides of semiconductor wafers

US6793837B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Guido Wenski · Burghausen, DE
• Thomas Altmann · Burghausen, DE
• Gerhard Heier · Burghausen, DE
• Wolfgang Winkler · Dresden, DE
• Gunther Kann · Wasserburg am Inn, DE

Key dates

• Filing date: Jun 18, 2002
• Grant date: Sep 21, 2004
• Expiry date: Oct 17, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B37/08
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A process is for material-removing machining, on both sides simultaneously, of semiconductor wafers having a front surface and a back surface, the semiconductor wafers resting in carriers which are set in rotation by means of an annular outer drive ring and an annular inner drive ring and being moved between two oppositely rotating working disks in a manner which can be described by means of in each case one path curve relative to the upper working disk and one path curve relative to the lower working disk, wherein the two path curves after six loops around the center have the appearance of still being open, and at each point have a radius of curvature which is at least as great as the radius of the inner drive ring.