Patent · US Expired

Process for producing a semiconductor wafer

US6997776B2 · kind B2 · utility

1Cited by

8References

7Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Gunther Kann · Wasserburg am Inn, DE
Manfred Thurner · Ach, AT
Karl-Heinz Wajand · Ach, AT
Armin Deser · Burghausen, DE
Markus Schnappauf · Rosenheim, DE

Key dates

Filing date	Jan 27, 2005
Grant date	Feb 14, 2006
Priority date	—
Expiry date	Jan 27, 2025

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P80/30
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

The invention relates to a process for producing a semiconductor wafer by simultaneous polishing of a front surface and a back surface of the semiconductor wafer with a polishing fluid between rotating polishing plates during a polishing run which lasts for a polishing time, the semiconductor wafer being located in a cutout in a carrier having a defined carrier thickness and being held on a defined geometric path, the semiconductor wafer having a starting thickness prior to polishing and a final thickness after polishing. The polishing time for the polishing run is calculated from data which include the starting thickness of the semiconductor wafer and the carrier thickness as well as the starting thickness and final thickness and the flatness of a semiconductor wafer which was polished during a polishing run preceding the present polishing run.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.