Hang-Shing Ma
4Patents
2h-index
8Co-inventors
30Inventor score
Filing activity: Oct 28, 2011 → Aug 26, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9449913B2 | 3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias | Electricity | 15 | Active |
| US9142510B2 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Electricity | 14 | Active |
| US10155738B2 | Methods for skin whitening using a gallotannin | Chemistry; Metallurgy | 0 | Active |
| US9530740B2 | 3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.