Harry Chandra
5Patents
4h-index
4Co-inventors
46Inventor score
Filing activity: Sep 25, 2008 → Aug 22, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8110441B2 | Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die | Electricity | 26 | Active |
| US8598690B2 | Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground | Electricity | 13 | Active |
| US8653654B2 | Integrated circuit packaging system with a stackable package and method of manufacture thereof | Electricity | 9 | Active |
| US8723302B2 | Integrated circuit package system with input/output expansion | Electricity | 8 | Active |
| US10991644B2 | Integrated circuit package having a low profile | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.