Integrated circuit package system with input/output expansion
US8723302B2 · kind B2 · utility
8Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2008 |
| Grant date | May 13, 2014 |
| Priority date | — |
| Expiry date | Apr 1, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package system includes: forming a base stacking package including: fabricating a base substrate, mounting an integrated circuit on the base substrate, positioning an input/output expansion substrate, having access ports around an inner array area, over the integrated circuit, and injecting a molding compound on the base substrate, the integrated circuit, and the input/output expansion substrate; and mounting a top package on the input/output expansion substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.