Heiko Assmann
2Patents
0h-index
10Co-inventors
28Inventor score
Filing activity: May 16, 2017 → Dec 17, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11276624B2 | Semiconductor device power metallization layer with stress-relieving heat sink structure | Electricity | 0 | Active |
| US10331036B2 | Exposure mask, exposure apparatus and method for calibrating an exposure apparatus | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.