Patent · US Active

Apparatus, device and method for wafer dicing

US9349645B2 · kind B2 · utility

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0References

13Claims

0Family size

Assignee

NXP B.V. · NL

Inventors

Martin Lapke · Hamburg, DE
Hartmut Buenning · Norderstedt, DE
Sascha Moeller · Hamburg, DE
Guido Albermann · Hamburg, DE
Thomas Rohleder · Hamburg, DE
Heiko Backer · Hamburg, DE

Key dates

Filing date	Oct 16, 2013
Grant date	May 24, 2016
Priority date	—
Expiry date	Feb 3, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T225/298
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

An apparatus, device and method for wafer dicing is disclosed. In one example, the apparatus discloses: a wafer holding device having a first temperature; a die separation bar moveably coupled to the wafer holding device; and a cooling device coupled to the apparatus and having a second temperature which enables the die separation bar to fracture an attachment material in response to movement with respect to the wafer holding device. In another example, the method discloses: receiving a wafer having an attachment material applied to one side of the wafer; placing the wafer in a holding device having a first temperature; urging a die separation bar toward the wafer; and cooling the attachment material to a second temperature, which is lower than the first temperature, until the attachment material fractures in response to the urging.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.