Inventor · Burghausen, DE

Helmut Seehofer

2Patents
1h-index
6Co-inventors
27Inventor score

Filing activity: Oct 25, 2007 → Apr 21, 2008

Most-cited inventions

PatentTitleAreaCited byStatus
US7766724B2 Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers Performing Operations; Transporting 3 Active
US10245661B2 Wire guide roll for wire saw and method Emerging Cross-Sectional Technologies 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.