Patent · US Active

Wire guide roll for wire saw and method

US10245661B2 · kind B2 · utility

1Cited by

17References

21Claims

0Family size

Assignee

Siltronic AG · DE

Inventors

Anton Huber · Burghausen, DE
Engelbert Auer · Altötting, DE
Manfred Schoenhofer · Julbach, DE
Helmut Seehofer · Burghausen, DE
Peter Wiesner · Simbach, DE

Key dates

Filing date	Apr 21, 2008
Grant date	Apr 2, 2019
Priority date	—
Expiry date	Jul 4, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/9292
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A wire guide roll for use in wire saws for simultaneously slicing a multiplicity of wafers from a cylindrical workpiece is provided with a coating having a thickness of at least 2 mm and at most 7.5 mm of a material which has a Shore A hardness of at least 60 and at most 99, and which contains a multiplicity of grooves through which the sawing wire is guided, the grooves each having a curved groove base with a radius of curvature which is 0.25-1.6 times the sawing wire diameter, and an aperture angle of 60-130°. A multiplicity of wafers are simultaneously sliced from a cylindrical workpiece by a wire saw using such wire guide rolls.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.