Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers

US7766724B2 · kind B2 · utility

Assignee

• Siltronic AG · DE

Inventors

• Anton Huber · Burghausen, DE
• Alexander Heilmaier · Haiming, DE
• Clemens Radspieler · Simbach, DE
• Helmut Seehofer · Burghausen, DE

Key dates

• Filing date: Oct 25, 2007
• Grant date: Aug 3, 2010
• Expiry date: Jul 5, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B28D5/042
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, is satisfied,