Method for fabricating solder bumps by forming solder balls with a solder ball forming member
US6025258A · kind A · utility
52Cited by
7References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1995 |
| Grant date | Feb 15, 2000 |
| Priority date | — |
| Expiry date | Aug 17, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.