Ground plane on 2 layer PBGA
US6687133B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2002 |
| Grant date | Feb 3, 2004 |
| Priority date | — |
| Expiry date | Nov 15, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A two layer PBGA which includes a metal ground plane at its bottom layer. The ground plane is preferably a metal plane which is connected to ground through a metal connection to a ball pad at the center of the package and a ball pad proximate the edge of the package. The ground plane is voided around the signal and power balls, via and “dog bones”. The PBGA is configured such that the ground plane serves effectively the same function as the second layer ground plane in a conventional four layer PBGA. The PBGA provides a cheaper alternative to the generally more expensive four layer PBGA, and provides better cross talk performance (especially for high frequency signaling) as well as better thermal performance as a result of having more metal at the bottom layer of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.