Honny Chen
2Patents
1h-index
9Co-inventors
33Inventor score
Filing activity: Dec 30, 2016 → Apr 13, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10304816B2 | Semiconductor device including stacked die with continuous integral via holes | Electricity | 2 | Active |
| US11488883B1 | Semiconductor device package having thermally conductive layers for heat dissipation | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.