Hou Boon Tan
2Patents
2h-index
8Co-inventors
30Inventor score
Filing activity: Jul 25, 1997 → Nov 13, 2000
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5920113A | Leadframe structure having moveable sub-frame | Electricity | 5 | Expired |
| US6436736B1 | Method for manufacturing a semiconductor package on a leadframe | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.