Method for manufacturing a semiconductor package on a leadframe
US6436736B1 · kind B1 · utility
4Cited by
10References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2000 |
| Grant date | Aug 20, 2002 |
| Priority date | — |
| Expiry date | Nov 13, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor package (30) on a leadframe (20) trimmed from strip (10). Encapsulant (34) forms plastic tie bars (40) linking the semiconductor package (30) and the strip (10), to mechanically support, but electrically isolate, the semiconductor die (31) for functionality testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.