Hsiu Chen
3Patents
2h-index
12Co-inventors
41Inventor score
Filing activity: Nov 13, 2001 → Jan 2, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6696763B2 | Solder ball allocation on a chip and method of the same | Electricity | 3 | Expired |
| US6812409B2 | Layer allocating apparatus for multi-layer circuit board | Electricity | 2 | Expired |
| US9109066B2 | Method for preparing a flame retardant modified acrylonitrile-based copolymer and a flame retardant fibrous material | Textiles; Paper | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.