Hubert Vander Plas
3Patents
3h-index
5Co-inventors
36Inventor score
Filing activity: Jul 29, 2002 → Dec 14, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6716737B2 | Method of forming a through-substrate interconnect | Electricity | 81 | Expired |
| US6902872B2 | Method of forming a through-substrate interconnect | Electricity | 5 | Expired |
| US7432582B2 | Method of forming a through-substrate interconnect | Electricity | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.